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HTCC, full name of High Temperature co-fired Ceramic, is called multi-layer high temperature co-firing technology. Usually used for multilayer ceramic circuit boards, and then high precision, high integrated circuit applications.
LTCC, full name of Low Temperature co-fired Ceramic, is known as low temperature co-fired ceramic technology. LTCC technology involves layering ceramic materials as required, printing interconnecting conductors, components and circuits internally, and firing them into an integrated ceramic multilayer material.
HTCC and LTCC process material difference
The high-temperature co-fired ceramics of HTCC are mainly composed of alumina, mullite and aluminum nitride, and the ceramic powder of HTCC does not include glass material. Due to the high firing temperature of HTCC substrate, low melting point metal materials such as gold, silver and copper cannot be used, while conductor paste materials are tungsten, molybdenum, molybdenum, manganese and other high melting point metal heating resistance paste.
LTCC low-temperature co-fired ceramics in order to ensure high sintering density under low-temperature co-fired conditions, amorphous glass, crystallized glass, low melting point oxides, etc. are usually added to the components to promote sintering. Glass and ceramic composite is a typical low temperature co-fired ceramic material. In addition, there are crystallized glass, crystallized glass and ceramic composites and liquid phase sintered ceramics. The metals used are high conductivity materials (Ag, Cu, Au and their alloys, such as Ag-Pd, Ag-Pt, Au-Pt, etc.), which can not only reduce the cost, but also obtain good performance.
HTCC and LTCC process differences
The overall technological process of LTCC and HTCC is very similar. Both of them have to go through the preparation process of slurry preparation, casting strip, drying green blank, drilling through hole, screen printing hole filling, screen printing line, laminated sintering, and finally slicing. The equipment required is similar. However, due to the big difference in materials, the co-firing temperature of LTCC and HTCC in the production process is quite different. HTCC has a sintering temperature above 1650℃, while LTCC has a sintering temperature below 950℃. The LTCC process has been developed due to the high sintering temperature, huge energy consumption and limited metal conductor materials of HTCC substrate.
HTCC and LTCC application differences
● LTCC application of Ceramic PCB
LTCC uses Au, Ag, Cu and other metals with high conductivity and low melting point as conductor materials. Due to the low dielectric constant and high frequency and low loss properties of glass ceramics, LTCC is very suitable for application in radio frequency, microwave and millimeter wave devices. It is mainly used in the field of high frequency wireless communication, aerospace, memory, drivers, filters, sensors and automotive electronics.
Commonly used LTCC electronic components include filters, diplexers, antennas, barron, couplers, power splitters, common mode chokes, etc., widely used in mobile communication terminals, WiFi, automotive electronics, T/R components and other fields.
● Application of HTCC of Ceramic PCB
Due to high sintering temperature, HTCC cannot use gold, silver, copper and other low melting point metal materials, must use tungsten, molybdenum, manganese and other refractory metal materials, these materials have low electrical conductivity, will cause signal delay and other defects, so it is not suitable for high-speed or high-frequency microassembled circuit substrate. However, because HTCC substrate has the advantages of high structural strength, high thermal conductivity, good chemical stability and high wiring density, it has a wide application prospect in high-power microassembled circuits. Because of its high thermal conductivity, good structural strength and stable physical and chemical properties, HTCC ceramic substrate is widely used in high reliability microelectronics integrated circuits, high-power microassembly circuits, high-power on-board circuits and other fields.
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